Realme X9 Pro Specifications Leaked: Dimensity 1200 chipset and 108MP rear camera

According to the 91Mobiles, specifications of the new Realme X9 Pro have been unveiled on social media. @WHYLAB revealed on Weibo that the device is equipped with a MediaTek Dimensity 1200 chip, the screen specification is FHD+ / 90Hz high refresh rate, and there is an Infinity-O hole in the upper left corner.

In addition, as an imaging flagship, Realme equipped the X9 Pro with a 108 million pixel main camera, supplemented by a 4500 mAh battery that supports 65W fast charging.

91Mobiles pointed out that Realme just launched the X7 series in the Indian market last month. But judging from the latest developments on Weibo, the company is clearly ready to release the new X7 series later this year.

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Prior to this, the company has also released a preview of the Realme GT performance flagship on March 4. At the same time, Realme disclosed a “dual platform, dual flagship” strategy to ensure that two flagship smartphone product lines can be provided within one year.

Taking this year as an example, one of them is obviously the Qualcomm Snapdragon 888 chipset platform, and the other is the MediaTek Dimensity 1200 chipset. The upcoming Realme 8 series is also expected to adopt 108MP rear camera.

Considering that this is the first time we have heard about Realme X9 Pro configuration information, the above specifications still need to be further tested.

As for the Realme GT on March 4, the official has revealed that the machine uses Qualcomm Snapdragon 888 chipset, 120Hz high refresh screen, stainless steel VC cooling system, and two-tone artificial leather color matching, and the price may be less than 2999 RMB.

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