Earlier news stated that the Huawei P50 series is expected to be released in May or June, and the Honor 50 series is also on the way. Previously, Huawei P50 series were revealed, using a centered single-hole full screen + dual-ring rear camera; recently, Honor 50 Pro+ configuration parameters were exposed, equipped with Snapdragon 888 flagship chip + 50MP rear four cameras, rear camera module The upper and lower ring type is also adopted.
As we all know that Huawei and Honor are going to launch their new flagship phones within the coming 2 or 3 months and the renders of these new flagship phones are in the headlines on a coming day. As you are seeing, a new Render of Honor 50 has come out which looks very amazing to see. Let’s look at the specifications of Honor 50.
The specification of Honor 50 Pro+ has leaked online. According to the leak specifications image, the Honor 50 Pro+ is equipped with Qualcomm Snapdragon 888, supplemented by a combination of 8GB+128GB memory, but it is probably only the initial version, and a larger memory version will be launched, using LPDDR5 memory and UFS 3.1 flash memory;
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The phone has four rear cameras, including a 50-megapixel main camera, a 13-megapixel ultra-wide-angle camera, an 8-megapixel telephoto camera, and a TOF lens, and a front-facing 32 MP + 8 MP dual camera. As far as the battery concern, this phone has a built-in 4400mAh, 66W wired fast Charge, and 50W wireless charging.
In addition, due to the dual front camera, this phone is likely to be a dual-hole screen similar to the Honor V40. The screen size is 6.79 inches and supports 2K+120Hz. Honor 50 Pro+ has a high probability of supporting IP68 waterproof and dustproof.
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