Honor 50 series/X20SE may come with SD 778G, Dimensity 900, Dimensity 700

The official Weibo of Honor previously announced that the Honor 50 series will be released in Shanghai on June 16. At present, the Honor 50 series has been put on the shelves in major shopping malls and pre-booking has been opened, but users are most concerned about whether the 50 lineup is really only equipped with Snapdragon 778G instead of Snapdragon 888.

Now some well-known tipsters have announced the SoC information of this series of models. According to reports, the Honor 50 series are both Qualcomm Snapdragon 778G chips, while the lower-end Honor 50SE is equipped with MediaTek Dimensity 900 chips. Another Honor X20 SE is a lower Dimensity 700 chip.

According to 3C certification information, Honor 50 and 50 Pro will support 66W and 100W wired fast charging respectively, and Honor has announced that at least one of the Honor 50 series will be the first Qualcomm Snapdragon 778G chip.

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According to the previous information, the new device will provide at least a green orange gradient, blue-purple gradient, and sky color matching. It adopts AG matte technology and a 1+2 double-ring three-camera design on the back.

It seems to be periscope + outsole. The combination of the main camera + ultra-wide-angle is consistent with the circular camera module in the trailer. In addition, the latest renderings of the Honor 50 series indicate that the machine will be equipped with a 108MP main camera.


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