The Honor 50 series launch conference will be held on June 16th. Today, the spokesperson of this series of new devices-Gong Jun was officially announced. For the Honor 50 series, it is reported that there will be three models in this series.
Both of the Honor 50 series are Qualcomm Snapdragon 778G chips, while the lower-end Honor 50SE is equipped with MediaTek Dimensity 900 chips. According to 3C certification information, Honor 50 and 50 Pro will support 66W and 100W wired fast charging respectively, and Honor has announced that at least one of the Honor 50 series will be the first Qualcomm Snapdragon 778G chip.
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Honor also released another promotional poster for the Honor 50 series of new devices, showing that the new machine will provide at least four color schemes, and it is suspected of using AG matte technology, with a 1+3 double ring and four cameras on the back.
In addition, the poster also announced some configurations, including a 100MP main camera, 100W super-fast charging, and a 1 billion colors super curved screen.
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