Samsung just announced the company’s latest 5G RAN antenna and supporting chipset solutions, which are designed to reduce the trouble of mobile operators when deploying 5G mobile networks.
During the Samsung Network: Redefined online event, the company introduced the latest One Antenna Radio integrated antenna solution. Mobile operators can combine the 3.5GHz Massive MIMO wireless frequency band with the passive mid and low-frequency bands to accelerate the installation and deployment of 5G mobile networks.
By saving space and simplifying the installation to save mobile operators’ deployment and operating costs, Samsung’s One Antenna Radio solution can cope with the challenges of different base station locations and environments.
Based on this, operators do not need to separately install and connect multiple antenna components, and the streamlined structure makes the hardware more compact, making 5G network deployment easier.
Wonil Roh, Senior Vice President and Head of Product Strategy, Samsung Electronics Network Business, said:
- We are proud to launch the One Antenna Radio solution, dedicated to providing industry-leading performance and coping with the challenges of various deployment environments.
- For most operators, resource expenditures such as hardware installation, wiring, labor, and space have become a major challenge they have to face.
- Samsung One Antenna Radio provides a more advantageous solution and helps expand the boundaries of deployment.
- Related 5G solutions will be added to Samsung’s radio access network (RAN) product portfolio in early 2022, and will be the first to be launched in the European market.
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At the same time, Samsung announced a series of 5G chipsets (3GPP Rel.16 compatible products), including digital front-end-radio frequency chip (DFE-RFIC) integrated products, second-generation 5G modem SoC, and third-generation millimeter-wave radio frequency Integrated circuit (RFIC) chip.
Anshel Sag of Moor Insights & Strategy pointed out that 5G chipsets are critical to meeting the performance requirements required for next-generation network deployments. The long-term experience that Samsung has led and accumulated in this area has also given the company some key differentiated advantages.
By positioning itself as a leader in providing 5G network solutions, the company can provide corresponding features and advantages to operator customers seeking to advance its 5G strategy.
For example, the company’s DFE-FRIC integrated chip integrates millimeter wave and DFE and RFIC functions in the frequency spectrum below 6GHz.
Based on this, the technology giant was able to successfully launch its own solutions such as 5G Compact Macro. While increasing the output power and bringing double bandwidth, it also reduces the footprint of the equipment.
The second-generation 5G modem SoC will enable the baseband unit to have greater capacity and lower unit power consumption, and support sub-6GHz and millimeter wave frequency bands.
This provides an enhanced power efficiency and beamforming experience for massive MIMO radio and 5G Compact Macro solutions.
And with the blessing of the third-generation millimeter-wave RFIC chip, the 5G Compact Macro platform can also successfully support the 39GHz and 28GHz spectrum, and can promote the implementation of compact 5G radio frequency through enhanced power.
Junhee Lee, Executive Vice President and Head of Network Business R&D at Samsung Electronics, said:
This chipset is a basic part of our most advanced 5G solution. Through long-term research and development efforts, Samsung has been able to be at the forefront of providing cutting-edge 5G technology.
As one of the world’s largest semiconductor companies, we are committed to developing the most innovative chips for the next stage of 5G development and helping mobile operators maintain their competitiveness.
At the same time, Samsung announced a series of 5G chipsets (3GPP Rel.16 compatible products), including digital front-end-radio frequency chip (DFE-RFIC) integrated products, second-generation 5G modem SoC, and third-generation millimeter-wave radio frequency Integrated circuit (RFIC) chip.
Anshel Sag of Moor Insights & Strategy pointed out that 5G chipsets are critical to meeting the performance requirements required for next-generation network deployments. The long-term experience that Samsung has led and accumulated in this area has also given the company some key differentiated advantages.
By positioning itself as a leader in providing 5G network solutions, the company can provide corresponding features and advantages to operator customers seeking to advance its 5G strategy. For example, the company’s DFE-FRIC integrated chip integrates millimeter-wave and DFE and RFIC functions in the frequency spectrum below 6GHz.
Based on this, the technology giant was able to successfully launch its own solutions such as 5G Compact Macro. While increasing the output power and bringing double bandwidth, it also reduces the footprint of the equipment.
The second-generation 5G modem SoC will enable the baseband unit to have greater capacity and lower unit power consumption, and support sub-6GHz and millimeter-wave frequency bands. This provides enhanced power efficiency and beamforming experience for massive MIMO radio and 5G Compact Macro solutions.
And with the blessing of the third-generation millimeter-wave RFIC chip, the 5G Compact Macro platform can also successfully support the 39GHz and 28GHz spectrum and can promote the implementation of compact 5G radio frequency through enhanced power.
Junhee Lee, Executive Vice President and Head of Network Business R&D at Samsung Electronics, said: This chipset is a basic part of our most advanced 5G solution. Through long-term research and development efforts, Samsung has been able to be at the forefront of providing cutting-edge 5G technology.
As one of the world’s largest semiconductor companies, we are committed to developing the most innovative chips for the next stage of 5G development and helping mobile operators maintain their competitiveness.
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