OnePlus R&D director Liu Fengshuo said that in the past few years, the performance of mobile phone flagship chips has continued to improve, and the performance of CPU, GPU, and AI has continued to improve. At the same time, chip power consumption is also rising, and performance under high load has approached the level of low-power PC chips.
Based on this background, the OnePlus 10 Pro is equipped with the latest generation of Qualcomm’s flagship mobile platform, the new Snapdragon 8. Fengshuo Liu pointed out that in order to allow game lovers to play stably for a long time, they have put a lot of effort into heat dissipation:
- Using a space cooling system, the overall cooling area is 34119.052 mm², which is the largest cooling area in the history of OnePlus;
- VC soaking plate, copper graphite sheet, graphite sheet, heat dissipation silica gel, metal frame are used on the heat dissipation material;
- In the reconstruction of the stack structure, the heat source distributed stacking design is adopted to form a heat dissipation channel, which makes the heat dissipation efficiency rapidly improve.
At the same time, Liu Fengshuo also exposed a real shot of the internal heat dissipation structure of the OnePlus 10 Pro. He glued the internal heat dissipation structure of the 10 Pro to A4 paper, accounting for about 55% of the entire paper, and said that the OnePlus 10 Pro is OnePlus The strongest cooling system to date.
OnePlus will hold a new product launch conference on January 11 to launch the OnePlus 10 Pro mobile phone. In terms of configuration, the OnePlus 10 Pro uses the combination of Snapdragon 8+LPDDR5+UFS3.1, equipped with a three-dimensional space cooling system, and also has a gaming triple Wi-Fi antenna system, supports 80W wired flash charging + 50W wireless flash charging, and has a built-in 5000mAh large Battery, support USB 3.1.
