Samsung Electronics today denied the report of the local South Korean media “Dong-A Ilbo” about delaying 3nm mass production. The “Dong-A Ilbo” previously reported that Samsung’s 3nm mass production will be further delayed because the yield rate is far below the target.
A Samsung spokesman said by phone that Samsung is still on schedule to start mass production of 3nm chips in the second quarter. Yesterday Korean media BusinessKorea reported that Samsung is betting on 3nm GAA technology in order to catch up with TSMC, and plans to mass-produce 2nm chips based on the GAA process in 2025.
It is reported that Samsung used the 3nm GAA process wafer for trial production in early June, becoming the first company in the world to use GAA technology. Samsung hopes to quickly narrow the gap with TSMC through technological leaps. The 3nm process improves semiconductor performance and cell efficiency by 15% and 30%, respectively, while reducing the chip area by 35% compared to the 5nm process.
Experts say Samsung could be a game-changer in the foundry market if it guarantees stable yields in its GAA-based 3nm process. TSMC is expected to introduce the GAA process starting with 2nm chips and release the first product around 2026. For Samsung Electronics, the next three years will be a critical period.
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