Samsung Electronics has replaced the head of the semiconductor research and development center leading the development of next-generation chips. At the same time, the main executives of the foundry business competing with TSMC in the world foundry market were reshuffled.
Samsung Electronics has reportedly appointed vice president and head of its flash memory development division, Song Jae-hyuk, as the new head of its semiconductor research and development center. The song is credited with orchestrating the transition to vertical NAND flash and the development of super-stacked NAND flash.
In the foundry business restructuring, Nam Seok-woo, vice president of global manufacturing and infrastructure for the semiconductor business of Samsung’s Device Solutions (DS) division, will also serve as the head of the foundry manufacturing technology center. Nam is one of Samsung Electronics’ best memory semiconductor process development experts.
In addition, Kim Hong-shik, vice president of the Memory Manufacturing Technology Center, was appointed to lead the foundry technology and innovation team. Through the reorganization, Samsung Electronics mobilized memory semiconductor experts to lead the core division of the foundry business.
“Samsung Electronics has suffered from foundry customers due to low yields and failure to develop fifth-generation DRAMs,” said an analyst at an investment firm. “It appears that the company is seeking solutions to these problems.”
Samsung Electronics’ foundry business is facing a major test. It plans to mass-produce the world’s first GAA-based 3-nanometer chip as early as June. Market watchers say the company could change the landscape of the global foundry market if it secures steady production.
Meanwhile, Samsung Electronics Vice Chairman Lee Jae-Yong will travel to the Netherlands next week after meeting with the chief executives of Intel and Qualcomm. Lee’s trip has sparked speculation that the company is making considerable strides in making large-scale mergers and acquisitions (M&A) deals.
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