Samsung chip and foundry executives reshuffle their cards to accelerate the improvement of 3nm yields and compete with TSMC

According to Korean media reports, Samsung Electronics has replaced the head of the semiconductor R&D center responsible for developing next-generation chips, and the top management of the foundry business has also been reshuffled, with storage experts leading the core department of the foundry business.

According to industry analysis, when the mass production of 3 nanometers is about to take the lead, it has been repeatedly reported that the poor yield rate of Samsung’s advanced process is the biggest problem.

Samsung Electronics has appointed vice president and head of its Flash development division, Song Jae-hyuk, as the new head of its semiconductor research and development center, sources said.

For the foundry business, Nam Seok-woo, vice president of global manufacturing and infrastructure of the Semiconductor Equipment Solutions Division, was assigned as the head of the foundry manufacturing technology center.

It is reported that the two are experts in Samsung’s storage process technology development. Samsung also appointed Kim Hong-shik, vice president of the Memory Manufacturing Technology Center, to lead the foundry technology, innovation team.

According to the report, Samsung expects to mass-produce the 3-nanometer process as soon as this (6) months, overtaking TSMC, which plans to mass-produce the 3-nanometer process in the second half of the year.

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