Pixel 7a utilizes IPOP packaging for Tensor G2 chip

Google launched the Pixel 7a smartphone in May of this year, featuring the highly anticipated Tensor G2 processor. Recent insights shared by the reputable source, Kamila (@Za_Raczke), reveal that the Pixel 7a incorporates a derivative version of the Tensor G2 chip, exhibiting a slightly lower performance than its counterpart in the Pixel 7 series.

In a tweet, Kamila highlights the intricate nature of integrated circuit production, emphasizing the significance of the packaging process. Notably, the Tensor G2 chip within the Pixel 7a employs the “IPOP” packaging scheme, in contrast to the “FOPLP” packaging utilized in the Pixel 7 series. It is worth noting that the IPOP packaging process is not only more cost-effective but also results in a thicker, larger chip, leading to increased heat generation compared to FOPLP.

Furthermore, it is important to acknowledge that the Pixel 7a and the Pixel 7 series incorporate distinct heat dissipation strategies. Consequently, it remains premature to ascertain the precise impact of heat dissipation on overall performance during this stage of evaluation.

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