YouTube blogger Gamers Nexus has now released a video of the Steam Deck disassembly, showing the internal structure of the Steam Deck. As shown in the picture above, the Steam Deck uses a single heat pipe + a small fan to dissipate heat.
After removing the heatsink, you can see the AMD Van Gogh APU on this handheld and the four Micron memories around it. The area where the SSD and NIC are installed on the CPU.
The CPU part of the Van Gogh APU uses the Zen2 architecture, 4-core specifications, 2.4 GHz to 3.5 GHz. Valve claims its goal is to deliver stable frequencies, rather than focusing on peak frequencies that don’t last long.
In the GPU part, the Van Gogh APU integrates an 8 CU RDNA2 GPU with a frequency of 1.0 GHz to 1.6 GHz and performance of 1.6TFops FP32. The TDP of the entire SoC is 4 to 15W, and it supports LPDDR5 memory with a capacity of 16GB. Storage optional 64GB eMMC and 512/1024 GB NVMe SSD.
A few days ago, Valve officially announced that the Steam Deck game console is scheduled to be released on February 25. Officials will send out the first emails to pre-orders of the handheld on February 25th PT with a link to place an order. After the user receives the email, they will have 3 days to make a purchase on a first-pay, first-served basis.