The Intel 12th-generation Core has replaced the new interface/socket LGA1700, which has changed from the square (37.5×37.5mm) of the previous two generations of LGA1200 to a rectangle (37.5×45.0mm), so the entire fixing bracket and fastener are redesigned.
However, the design of the LGA1700 socket seems to be ill-conceived, the locking pressure is significantly greater than that of the LGA1200, and the change in the thickness of the 12th-generation processor itself will cause the processor (to be precise, the center of the heat dissipation top cover) to be slightly bent.
Although this will not affect the performance and life of the processor itself, it will drag down the heat dissipation effect, and the processor temperature will increase by a few degrees.
The German media Igor’s Lab once tried adding a 1mm thick M4 washer to each of the four corner screw positions of the LGA1700 socket to share the locking pressure.
Australian overclocker Karta changed his mind and used advanced 3D printers and plastic materials to create a bracket for the LGA1700 socket to adjust the height.
Another overclocker, Luumi, used an i5-12600K and an EVGA Z690 DARK KINGPIN to test this 3D printed bracket. The Prime95 oven test ran and found that the temperature did not change.
However, he believes that it is likely that the water block itself has a convex surface that has been used many times, or that the height of the bracket needs to be further adjusted accurately, but the pressure distribution of the 3D printed bracket is indeed much better.
Luumi said that it will also customize a new 3D printed bracket and adjust the height, hoping to obtain the same or even better heat dissipation effect than the gasket scheme.