With Samsung’s new efforts, the Galaxy S22 may contain some very powerful hardware, but this upgrade brings a huge disadvantage; cooling these components in such a small space. The Korean giant may now have a solution, which is to reintroduce heat pipe cooling in the flagship series. Samsung was originally one of the first companies to adopt heat pipe cooling. According to a new report from DigiTimes, the company may re-adopt this solution in its 2022 smartphone lineup.
Although the report does not explicitly mention the shape of the heat pipe manufactured for the Galaxy S22 series, this cooling solution is usually reserved for high-end devices, such as powerful laptops. Due to its efforts on the new Exynos chipset, the company has attracted attention in the industry.
The S22 may be the first flagship mobile phone product with AMD RDNA2 GPU built-in. According to previous performance leaks, this RDNA2 GPU has beaten the Adreno 730 of the Snapdragon 895, and also beat the A14 Bionic in the graphics-focused test. In short, the rumored Exynos 2200 means high-performance products, but if powerful cooling technology is not used, this performance upgrade will be futile.
In a very compact space like the inside of the Galaxy S22, the temperature of the Exynos 2200 may easily reach the limit of thermal throttling, but the heat pipe can alleviate these effects. It is said that even Apple is testing this cooling solution for the iPhone 14 series, which shows that Samsung hopes to gain an advantage in the market by releasing products with heat pipes first.
Previously, Samsung used heat pipe technology in some Galaxy Note 20 and Galaxy Note 20 Ultra, while other devices used multilayer graphite cooling pads.
